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Snapdragon 810 back on track after heating issues solved?

Qualcomm has reportedly sorted the issue which was causing its Snapdragon 810 chip to overheat, so the processor will be ready to go by mid-March, according to rumours emanating from China.

Despite Qualcomm’s fervent denials, its Snapdragon 810 chip was widely reported to have suffered from a serious flaw which caused it to overheat when clocked beyond a certain threshold. The manufacturer has reportedly nixed those problems though, so the new chipset will finally enter mass-production with a view to being ready for March.

The rumours come by way of sources inside TSMC (Taiwan Semiconductor Manufacturing Company), the company who manufactures Qualcomm’s chips.

These heat-related issues reportedly drove Samsung to drop the chip for its Galaxy S6 flagship phone, in favour of an Exynos offering of its own manufacture. That decision could well give its Galaxy S6 an advantage in the race for sales this year, setting it apart from rival handsets.

LG opted to use the Snapdragon 810 for its upcoming LG G Flex 2 and no problems were reported by the company, but it’s believed that the clockspeed used wasn’t sufficient to bring on the problems reported by others. Of course, that isn’t likely to instil much confidence in tech-minded buyers, who may choose to wait for other devices which carry the later, ‘fixed’ version of the chip.

Sony and HTC are believed to be among the manufacturers who have been waiting on a more stable version of the Snapdragon 810 chipset. Production of their new flagships is likely to click into gear now, while Chinese start-up OnePlus is also likely to be able to move forward with development of its OnePlus Two.


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